V COB Series
V Series
MS Series
APro-S Series
APRO-H Series
APRO Series
TrailerLED Series
CTV PLUS Series
FL Series
With the innovation of Mini & Micro LED products and the expansion of market share, the mainstream technology competition between COB and MIP has become “hot”. The choice of packaging technology has a crucial impact on the performance and cost of Mini & Micro LED.
01 What is SMD?
The traditional SMD technology route is to encapsulate one RGB (red, green, and blue) light-emitting chip into a lamp bead, and then solder it to the PCB board through SMT patch solder paste to make a unit module, and finally splice it into a whole LED screen.
02 What is COB
COB is the abbreviation of Chip on Board in English. It means that multiple RGBs are directly soldered on a PCB board, and then an integrated film package is made into a unit module, and finally spliced into a whole LED screen.
COB packaging is divided into forward mounting and reverse mounting. The luminous angle and wire bonding distance of forward mounting COB limit the performance development of the product from the technical route. As an upgraded product of the regular COB, the flip-chip COB further improves reliability, simplifies the production process, has better display effects, perfect near-screen experience, can achieve true chip-level spacing, reach the level of Micro, and outperform traditional SMD products in terms of high brightness, high contrast, black consistency and display stability. Since the COB screen cannot sort single lamp beads with similar optical performance like the SMD screen, it needs to calibrate the entire screen before leaving the factory.
With the advancement of industry technology, the cost of COB packaging is also on a downward trend. According to the data from experts, in the P1.2 spacing segment products, the COB price is lower than that of SMD technology products, and the price advantage of smaller spacing products is more obvious.
03 What is MIP?
MIP, or Mini/Micro LED in Package, refers to cutting the light-emitting chips on the LED panel into blocks to form a single device or a multi-in-one device. After the light splitting and mixing optimization, it is soldered to the PCB board through SMT patch solder paste to make an LED display module.
This technical idea reflects “breaking the whole into parts”. The advantages are smaller chips, lower losses, and high display consistency. There is an opportunity to reduce costs and significantly increase production to improve the performance and efficiency of LED display devices.
The MIP solution will use full pixel testing to mix BIMs of the same grade to achieve color consistency, which can reach the cinema-level color gamut standard (DCI-P3 ≥ 99%); while splitting light and color, it will screen out and remove defective products to ensure the yield of each pixel point during terminal transfer, thereby reducing the cost of rework. In addition, MIP has better matching, is suitable for different substrates and different pixel pitch applications, and is compatible with medium and large-sized Micro LED display applications.
04 What is GOB
GOB, or Glue on Board, is a product that people have higher requirements for product quality and display effects, commonly known as lamp surface glue filling.
The emergence of GOB meets the market demand and has two major advantages: First, GOB has an ultra-high protection level and can be waterproof, moisture-proof, collision-proof, dust-proof, corrosion-proof, blue light-proof, salt-proof, and anti-static; second, due to the frosted surface effect, the display of point light source to surface light source conversion display is realized, the viewing angle is increased, the color contrast is increased, the moiré pattern is effectively eliminated, visual fatigue is reduced, and a more delicate display effect is achieved.
In summary, the three packaging technologies of SMD, COB and MIP have their own advantages and disadvantages, but for different application scenarios and needs, it is crucial to choose the right technology. Lanpu Video has a full range of products, has many international and domestic patents, has rich project experience in LED small-pitch display, and is committed to empowering more scenarios with a richer and smarter new display product matrix. Lanpu Video products are widely used in command centers, monitoring security, commercial advertising, sports competitions, home theaters, virtual shooting and other industries.
With technological breakthroughs and the continuous decline in costs, Mini & Micro LED will have great achievements in more fields. The choice between the currently popular COB and MIP is more of a differentiation rather than a substitution relationship. We at Lanpu Video have different preferences based on different customer needs.
The U MIP Series represents your next-generation micro LED wall with a 600 × 337.5 mm panel and P0.9 pixel pitch, engineered for high-end commercial and command applications.
The UMIP Series is engineered around next-generation MIP technology, making it one of the most stable and visually striking micro LED walls on the market.
600 × 337.5 mm cabinet for flexible 16:9 and custom configurations
Pixel pitch options from P0.9 to P1.5
Ultra-high contrast ratio with deep black reproduction
Advanced heat dissipation for long-term stability
170°+ viewing angle for consistent brightness and color
Front maintenance for easy access and faster servicing
Optional redundancy (power/data) for mission-critical applications
👉 Contact us today to get your customized quotation and project design
👉 Free technical consultation + same-day engineering support
👉 Fast 7-day delivery & 5-year warranty included
Send your project details now — transform your visual experience with U MIP Micro LED.
Email: marketing@canbest-led.com | WhatsApp: +86-13418683708
